VIA ELECTRONIC has developed a strong manufacturing know-how in low-temperature co-fired ceramics for highly integrated electronic devices. Its high permeability and permittivity and the good dielectric characteristics of ceramic, make this know-how suitable for controller electronics, RF designs, microsystems and sensors.

Technology assets

  • ability to embed passive elements, such as resistors, capacitors and inductors into the ceramic package, minimising the size of the module;
  • possibility to achieve a single multilayer laminated package with a high integration and interconnection level;
  • scientific or industrial applications in harsh environments, low or high temperature, vacuum or magnetic sensors for medical, defense, aerospace, telecommunications or automotive.

Interested in this technology?


Nicolas LOUEE

Technology Broker